Germany develops new high-temperature process to manufacture ultra-compact microchips

Germany develops a new high-temperature process to manufacture ultra-compact microchips

On May 20, according to People's Daily, researchers from the Fraunhofer Institute for Microelectronics Circuits and Systems (IMS) in Germany recently developed a new type of high-temperature process that can produce ultra-compact microchips. The microchip can also work at temperatures up to 300°C.

Conventional CMOS chips can sometimes tolerate high temperatures of 250°C, but their performance and reliability will rapidly decline. Another method is to perform continuous cooling of heat-sensitive microchips, but it is difficult to achieve. In addition, specialized high-temperature chips exist on the market, but they are oversized (minimum size is 1 micron).

The size of the microchip developed by IMS is only 0.35 microns, which is much smaller than the existing high-temperature chips and still maintains its proper function.

To develop a heat-resistant microchip, the researchers used a special high-temperature silicon-on-insulator (SOI) CMOS process to prevent leakage currents that affect the operation of the chip through an insulating layer. In addition, the researchers also used metal tungsten, which is less sensitive to temperature than the commonly used aluminum, thus extending the operating life of high-temperature chips.

In addition to geothermal energy, natural gas, or oil production, the microchip can also be used in the aerospace industry, for example, placed as close to the turbine engine as possible, recording its operating status, ensuring that it operates more efficiently and reliably.

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