South Korea develops new technology paper instead of silicon for circuit chips

South Korea develops new technology to use paper instead of silicon to make circuit chips

According to the report of the Yonhap News Agency on November 25th, the Korean domestic research group has developed a technology that can use paper like silicon (Si) substrates. The development of this technology can not only reduce the circuit price, but also reduce the environmental problems in the production and disposal of circuits.

Zhao Yongxun, professor of the KAIST Physics Department, said on the 24th that it has developed a technology that can combine nanometer (1 nanometer equals one billionth of a meter) units of ultra-small semiconductor components with paper. Most of the existing circuits are formed on the substrate of silicon material. In order to constitute a loop, the chemical engineering of the surface needs to be dissolved, and the process clock may cause environmental problems. Environmental issues must also be taken into consideration when destroying a long-lived circuit chip.

The research team put on and launched a super-small optical element with a width of 500 nanometers on paper for the first time. It was previously believed that the optical element, as a light-sensing element, could not properly operate after scattering light on a rough surface of paper. The group of Professor Zhao discovered through experimentation that if the fiber (cellulose) filaments on the surface of the paper are smaller than the size of the optical element, the fact that the optical element is placed even on the surface can exhibit high performance.

Prof. Zhao said, “As the demand for electronic products increases, the number of alternating cycles gradually decreases, and the number of circuits that must be abandoned is rapidly increasing.” He added, “This time the developed technology combines inexpensive paper with high-performance optical components. It is both environmentally friendly and inexpensive.” The results of the study are published in the 17th issue of the Advanced Materials magazine, an international academic magazine on materials.

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